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TE0808 "UltraSoM+" Zynq UltraScale+

Overview

The Trenz Electronic TE0808 is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+, max. 8 GByte DDR4 SDRAM with 64-Bit width, max. 512 MByte Flash memory for configuration and operation, 20 Gigabit transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

All this in a compact 5,2 x 7,6 cm form factor, at the most competitive price.

Key Features

• Xilinx Zynq UltraScale+
• ZU9EG 900 Pin Packages
• Rugged for shock and high vibration
• Memory
  - 4x 512 MByte (2 GByte) 64-Bit DDR4
  - 2x 256 MBit (2x 32 MByte) SPI Boot Flash (dual parallel)
• User I/O 
  - 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
  - Serial transceiver: GTR 4 + GTH 16
  - GT clocks, I2C 
  - PLL clock inputs and outputs
• Size: 52 x 76 mm
• 3 mm mounting holes for skyline heat spreader
• B2B Connectors: 4 x 160 pin
• Si5345 - 10 output PLL
• All power supplies on board, single 3.3V Power required 
  - 14 on-board DC/DC regulators and 13 LDO's 
  - LP, FP, PL separately controlled power domains
• Support for all boot modes (except NAND) and scenarios
• Support for any combination of PS connected peripherals
• Evenly spread supply pins for good signal integrity.

Heatsink

Made especially for the TE0808 board. Note that this heatsink requires a gapfiller; as such it is necessary for Trenz to install this part.

Part No.  KK0808-03

TE0808 ZU9 DevKit

Below are images of the kit currently being developed. It includes a ZU9 chip, mini ITX baseboard, power supply, enclosure, and reference design. A block diagram is also shown.

Baseboard Features

• Mini-ITX form factor
• ATX Power supply connector (12V only PS Required)
• optional 12V Standard Power Plug
• USB3 with USB3 HUB
• Gigabit Ethernet RJ45
• MicroSD Card (bootable)
• eMMC (bootable)
• PCIe slot - PS GT Connected, one PCIe lane (16 Lane Connector)
• Displayport Dual Lane PS GT Connected
• FMC HPC Slot (1.8V max VCCIO)
• Dual SFP+
• One Samtec FireFly (4 lanes bidir)
• Samtec FireFly reverse loopback
• Fan connectors
• Intel front panel connector (PWR/RST/LED)
• Intel HDA Audio connector
• CAN FD Transceiver (10 Pin IDC Connector)
• 20 Pin ARM JTAG Connector (PS JTAG0)

PC Enclosure Accessible I/O

• PCIe
• FMC
• Dual SFP+
• RJ45 Gigabit Ethernet
• 2x USB3 Host
• Displayport
• microSD
• Two LED's
• CAN FD (using DB9 to IDC10 Cable)

Core V1 Mini-ITX Housing - technical features

• Dimensions: 260 x 276 x 316 mm (B x H x T)
• Material: Steel
• Colour: Black
• Drive Slots: 2 x 3,5 Zoll (intern, 3,5 Zoll) and 2 x 2,5 Zoll (intern, 2,5 Zoll)
• Expansion slots: 2
• I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
• Maximum graphic card length: 255 mm (inner enclosure)
• Maximum graphic card length: 285 mm (outer enclosure)
• Maximum CPU cooler height: 140 mm
• Maximum length power supply: 200 mm

Package Contents Starter Kit

• 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
• 1 x Power Supply Be quiet! BN142 System Power 7, 400 Watt, 12V, ATX 2.3 with fan
• 1 x TE0808-04-09EG-1EA with ZU9
• 1 x TEBF0808-04 base board
• 1 x Heatsink MBH31001-15W/2.6
• 1 x TE0790-02 XMOD FTDI JTAG Adapter (compatible with Xilinx-Tools)
• 1 x TE0790-02L XMOD FTDI JTAG Adapter (independent from Xilinx-Tools)
• 1 x 8 GB Class 4 microSDHC card
• 1 x USB cable, Type A to Type B Mini, 2 meter length
• 2 x Phillips screws, M3 x 6, pan head, zinc coated
• 2 x Spacer bolts, M3, 10 mm

Embedded Development Suite

A hardware development platform is available. Latest documentation, design support files, reference design source files and tools are available for download free of charge.

* Device supported by the free Xilinx Vivado WebPACK tool.

Available Models