TE0808 "UltraSoM+" Zynq UltraScale+
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Overview
The Trenz Electronic TE0808 is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+, max. 8 GByte DDR4 SDRAM with 64-Bit width, max. 512 MByte Flash memory for configuration and operation, 20 Gigabit transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.
All parts are at least industrial temperature range of -40°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
All this in a compact 5,2 x 7,6 cm form factor, at the most competitive price.
Key Features
- Xilinx Zynq UltraScale+
- ZU9EG 900 Pin Packages
- Rugged for shock and high vibration
- Memory
- 4x 512 MByte (2 GByte) 64-Bit DDR4
- 2x 256 MBit (2x 32 MByte) SPI Boot Flash (dual parallel) - User I/O
- 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
- Serial transceiver: GTR 4 + GTH 16
- GT clocks, I2C
- PLL clock inputs and outputs - Size: 52 x 76 mm
- 3 mm mounting holes for skyline heat spreader
- B2B Connectors: 4 x 160 pin
- Si5345 - 10 output PLL
- All power supplies on board, single 3.3V Power required
- 14 on-board DC/DC regulators and 13 LDO's
- LP, FP, PL separately controlled power domains - Support for all boot modes (except NAND) and scenarios
- Support for any combination of PS connected peripherals
- Evenly spread supply pins for good signal integrity.
Other assembly options for cost or performance optimization plus high volume prices available on request.
Heatsink
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Made especially for the TE0808 board. Note that this heatsink requires a gapfiller; as such it is necessary for Trenz to install this part.
Part No. KK0808-03
TE0808 ZU9 DevKit
Below are images of the kit currently being developed. It includes a ZU9 chip, mini ITX baseboard, power supply, enclosure, and reference design. A block diagram is also shown.
Baseboard Features
- Mini-ITX form factor
- ATX Power supply connector (12V only PS Required)
- optional 12V Standard Power Plug
- USB3 with USB3 HUB
- Gigabit Ethernet RJ45
- MicroSD Card (bootable)
- eMMC (bootable)
- PCIe slot - PS GT Connected, one PCIe lane (16 Lane Connector)
- Displayport Dual Lane PS GT Connected
- FMC HPC Slot (1.8V max VCCIO)
- Dual SFP+
- One Samtec FireFly (4 lanes bidir)
- Samtec FireFly reverse loopback
- Fan connectors
- Intel front panel connector (PWR/RST/LED)
- Intel HDA Audio connector
- CAN FD Transceiver (10 Pin IDC Connector)
- 20 Pin ARM JTAG Connector (PS JTAG0)
PC Enclosure Accessible I/O
- PCIe
- FMC
- Dual SFP+
- RJ45 Gigabit Ethernet
- 2x USB3 Host
- Displayport
- microSD
- Two LED's
- CAN FD (using DB9 to IDC10 Cable)
Core V1 Mini-ITX Housing - technical features
- Dimensions: 260 x 276 x 316 mm (B x H x T)
- Material: Steel
- Colour: Black
- Drive Slots: 2 x 3,5 Zoll (intern, 3,5 Zoll) and 2 x 2,5 Zoll (intern, 2,5 Zoll)
- Expansion slots: 2
- I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
- Maximum graphic card length: 255 mm (inner enclosure)
- Maximum graphic card length: 285 mm (outer enclosure)
- Maximum CPU cooler height: 140 mm
- Maximum length power supply: 200 mm
Package Contents Starter Kit
- 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
- 1 x Power Supply Be quiet! BN142 System Power 7, 400 Watt, 12V, ATX 2.3 with fan
- 1 x TE0808-04-09EG-1EA with ZU9
- 1 x TEBF0808-04 base board
- 1 x Heatsink MBH31001-15W/2.6
- 1 x TE0790-02 XMOD FTDI JTAG Adapter (compatible with Xilinx-Tools)
- 1 x TE0790-02L XMOD FTDI JTAG Adapter (independent from Xilinx-Tools)
- 1 x 8 GB Class 4 microSDHC card
- 1 x USB cable, Type A to Type B Mini, 2 meter length
- 2 x Phillips screws, M3 x 6, pan head, zinc coated
- 2 x Spacer bolts, M3, 10 mm
Embedded Development Suite
A hardware development platform is available. Latest documentation, design support files, reference design source files and tools are available for download free of charge.
* Device supported by the free Xilinx Vivado WebPACK tool.
Available Models
Model | Form factor | FPGA | RAM | (GPU) | (VCU) | Temperature Range |
---|---|---|---|---|---|---|
TE0808-04-6BE21-A | 5.2 x 7.6cm | XCZU6EG-1FFVC900E | 4 GByte DDR4 | x | - |
extended |
TE0808-04-06EG-1E3 (low profile) |
5.2 x 7.6cm | XCZU6EG-1FFVC900E | 4 GByte DDR4 | x | - | extended (0°C to 100°C) |
TE0808-04-9BE21-A | 5.2 x 7.6cm | XCZU9EG-1FFVC900E | 4 GByte DDR4 | x | - |
extended |
TE0808-04-09EG-1EL (low profile) |
5.2 x 7.6cm | XCZU9EG-1FFVC900E | 4 GByte DDR4 | x | - | extended (0°C to 100°C) |
TE0808-04-9GI21-A | 5.2 x 7.6cm | XCZU9EG-2FFVC900E | 4 GByte DDR4 | x | - | industrial (-40°C to 85°C) |
TE0808-04-BBE21-A |
5.2 x 7.6cm | XCZU15EG-1FFVC900E | 4 GByte DDR4 | x | - | extended (0°C to 100°C) |
Pricing, Availability and Ordering
- Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
- Currently Available to US customers only.
- Please email Ray at This email address is being protected from spambots. You need JavaScript enabled to view it. with questions / quotes / orders.
Technical Documentation from Trenz Electronic
- Available upon request.