TE0820 Zynq UltraScale+ Module Datasheet
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Overview
The Trenz Electronic TE0820 is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+, 1 GByte DDR4 SDRAM with 32-Bit width, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.
All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.
All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.
Key Features
- Xilinx Zynq UltraScale+
- ZU3EG, 784 Pin Packages
- 4 x 5 cm form factor
- Rugged for shock and high vibration
- 2 x 512 MByte 32-Bit width DDR4 SDRAM
- 128 MByte SPI Boot Flash dual parallel
- 4 GByte e.MMC Memory (up to 64 GByte)
- GPU (Graphic Processing Unit)
- B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
- 14 x MIO, 132 I/O's x HP (3 banks)
- Serial transceiver: PS-GTR 4
- GT Reference clock input
- PLL for GT Clocks (optional external reference)
- 1 GBit Ethernet PHY
- USB 2.0 OTG PHY
- Real Time Clock
- All power supplies on board.
- Evenly spread supply pins for good signal integrity.
Other assembly options for cost or performance optimization plus high volume prices available on request.
Heatsink
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Made especially for the TE0820 board, suitable for use with ball grid array
Part No. 28606
Package Contents
- 1 x Zynq UltraScale+ MPSoC module TE0820 with ZU3EG
Available Models
| Model | Size (cm) | FPGA | RAM | SPI Flash | (GPU) | (VCU) | Temp. range | Availability |
|---|---|---|---|---|---|---|---|---|
| TE0820-02-02CG-1EA | 4 x 5 | XCZU2CG-1SFVC784E | 1 GByte DDR4 | 128 MByte | - | - | extended | 1 - 2 weeks |
| TE0820-02-03CG-1EA | 4 x 5 | XCZU3CG-1SFVC784E | 1 GByte DDR4 | 128 MByte | - | - | extended | 1 - 2 weeks |
| TE0820-02-04CG-1EA | 4 x 5 | XCZU4CG-1SFVC784E | 1 GByte DDR4 | 128 MByte | - | - | extended | 1 - 2 weeks |
| TE0820-02-02EG-1EA | 4 x 5 | XCZU2EG-1SFVC784E | 1 GByte DDR4 | 128 MByte | x | - | extended | 1 - 2 weeks |
| TE0820-02-02EG-1EL* | 4 x 5 | XCZU2EG-1SFVC784E | 1 GByte DDR4 | 128 MByte | x | - | extended | 1 - 2 weeks |
| TE0820-02-03EG-1EA | 4 x 5 | XCZU3EG-1SFVC784E | 1 GByte DDR4 | 128 MByte | x | - | extended | 1 - 2 weeks |
| TE0820-02-03EG-1EL* |
4 x 5 | XCZU3EG-1SFVC784E | 1 GByte DDR4 | 128 MByte | x | - | extended | 1 - 2 weeks |
| TE0820-02-04EV-1EA | 4 x 5 | XCZU4EV-1SFVC784E | 1 GByte DDR4 | 128 MByte | x | x | extended | 1 - 2 weeks |
* These modules are identically constructed to the TE0820-xx-xx-1Ex except there are 2.5 mm Samtec connectors installed instead of 4.0 mm.
Embedded Development Suite
A hardware development platform is available. Latest documentation, design support files, reference design source files and tools are available for download free of charge.
* Device supported by the free Xilinx Vivado WebPACK tool.
Pricing, Availability and Ordering
- Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
- Currently Available to US customers only.
- Please email Ray at This e-mail address is being protected from spambots. You need JavaScript enabled to view it with questions / quotes / orders.