TE0820 Zynq UltraScale+ Module Datasheet

TE0820 Zynq UltraScale+ Module

TE0820 Zynq UltraScale+ Module (bottom)

Overview

The Trenz Electronic TE0820 is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+, 2 GByte DDR4 SDRAM with 32-Bit width, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • Xilinx Zynq UltraScale+
  • ZU3EG, 784 Pin Packages
  • 4 x 5 cm form factor
  • Rugged for shock and high vibration
  • 2 GByte DDR4 SDRAM
  • 128 MByte SPI Boot Flash dual parallel
  • 4 GByte e.MMC Memory (up to 64 GByte)
  • GPU (Graphic Processing Unit)
  • B2B Connectors: 2 x 100 Pin and 1 x 60 Pin
    • 14 x MIO, 132 I/O's x HP (3 banks)
    • Serial transceiver: PS-GTR 4
    • GT Reference clock input
    • PLL for GT Clocks (optional external reference)
    • 1 GBit Ethernet PHY
    • USB 2.0 OTG PHY
    • Real Time Clock
  • All power supplies on board.
  • Evenly spread supply pins for good signal integrity.

Other assembly options for cost or performance optimization plus high volume prices available on request.

Heatsink

TE0820 Heatsink

Made especially for the TE0820 board, suitable for use with ball grid array

Part No. 28606

Package Contents

  • 1 x Zynq UltraScale+ MPSoC module TE0820 with ZU3EG

Available Models

Model Size (cm) FPGA RAM SPI Flash (GPU) (VCU) Temp.
range		Availability
TE0820-03-2AE21FA 4 x 5 XCZU2CG-1SFVC784E 1 GByte DDR4 128 MByte - - extended 1 - 2 weeks
TE0820-03-3AE21FA 4 x 5 XCZU3CG-1SFVC784E 1 GByte DDR4 128 MByte - - extended 1 - 2 weeks
TE0820-03-4AE21FA 4 x 5 XCZU4CG-1SFVC784E 1 GByte DDR4 128 MByte - - extended 1 - 2 weeks
TE0820-03-2BE21FA 4 x 5 XCZU2EG-1SFVC784E 1 GByte DDR4 128 MByte x - extended 1 - 2 weeks
TE0820-03-2BE21FL* 4 x 5 XCZU2EG-1SFVC784E 1 GByte DDR4 128 MByte x - extended 1 - 2 weeks
TE0820-03-3BE21FA 4 x 5 XCZU3EG-1SFVC784E 1 GByte DDR4 128 MByte x - extended 1 - 2 weeks
TE0820-03-3BE21FL*
 4 x 5 XCZU3EG-1SFVC784E 1 GByte DDR4 128 MByte x - extended 1 - 2 weeks
TE0820-03-4DE21FA 4 x 5 XCZU4EV-1SFVC784E 1 GByte DDR4 128 MByte x x extended 1 - 2 weeks

* These modules are identically constructed to the TE0820-xx-xBE21Fx except there are 2.5 mm Samtec connectors installed instead of 4.0 mm.

Embedded Development Suite

A hardware development platform is available. Latest documentation, design support files, reference design source files and tools are available for download free of charge.

* Device supported by the free Xilinx Vivado WebPACK tool.

Pricing, Availability and Ordering

  • Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
  • Currently Available to US customers only.
  • Please email Ray at This email address is being protected from spambots. You need JavaScript enabled to view it. with questions / quotes / orders.