TE0715 Module for Zynq-7 Z-7015 and -7030 Datasheet

Zynq Module TE0715 TE0715 Block Diagram


Trenz Electronic TE0715s are industrial-grade SoC modules integrating a Xilinx Zynq-7000 series SoC, a gigabit Ethernet transceiver, 1 gigabyte DDR3 SDRAM with 32-bit width, 32 megabyte Flash memory for configuration and operation, 4 transceivers, a USB ULPI transceiver, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/Os is provided via rugged high-speed stacking strips. All modules in 4 x 5 cm form factor are mechanically compatible. All this on a tiny footprint, smaller than a credit card, at the most competitive price. A free and open embedded development suite with reference designs is included.

Key Features

  • Xilinx Zynq-7000 (Z-7015, Z-7030) SoM (system on module), supported by the free Xilinx Vivado WebPACK tool
  • Rugged for shock and high vibration resistance
  • 2x ARM Cortex-A9
  • 10/100/1000 tri-speed gigabit Ethernet transceiver (PHY) with SGMII
    - MAC Address EEPROM
  • 32-Bit-wide 1 GByte DDR3 SDRAM
  • 32 MByte QSPI Flash memory (with XiP support)
  • Programmable Clock Generator
    - Transceiver Clock (default 125 MHz)
  • Plug-on module with 2× 100-pin and 1× 60-pin high-speed hermaphroditic strips
  • 132 FPGA I/Os (65 LVDS pairs possible) and 14 PS-MIO available on board-to-board connectors
  • 4 GTP/GTX (high-performance transceiver) lanes
    - GTP/GTX (high-performance transceiver) clock input
  • USB 2.0 high-speed ULPI transceiver
  • On-board high-efficiency DC-DC converters
    • 4.0 A x 1.0 V power rail
    • 1.5 A x 1.5 V power rail
    • 1.5 A x 1.8 V power rail
  • System management
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
  • Temperature compensated RTC (real-time clock)
  • User LED
  • Evenly-spread supply pins for good signal integrity
  • Assembly options for cost or performance optimization available upon request.

Heatsink - Spring-Loaded

Heatsink for TE0715

Made especially for TE0715 board, spring-loaded, weight: 60g

Part No. 26923

Package Contents

  • 1 Thermal Pad
  • 4 pressure springs
  • 2 spacers
  • 4 screws

Embedded Development Suite

A hardware development platform is available. Latest documentation, design support files, reference design source files and tools are available for download free of charge.

Available Models

Model FPGA SDRAM Temperature Range Availability
TE0715-04-15-1I XC7Z015-1CLG485I 1 GByte DDR3L industrial 1 - 2 weeks
TE0715-04-15-2I XC7Z015-2CLG485I 1 GByte DDR3L industrial 1 - 2 weeks
TE0715-04-30-1I XC7Z030-1SBG485I 1 GByte DDR3L industrial 1 - 2 weeks
TE0715-04-30-3E XC7Z030-3SBG485E 1 GByte DDR3L extended 1 - 2 weeks
TE0715-04-15-1I3*1) XC7Z015-1CLG485I 1 GByte DDR3L industrial 1 - 2 weeks
TE0715-04-30-1I3*1) XC7Z030-1SBG485I 1 GByte DDR3L industrial 1 - 2 weeks
TE0715-04-30-1C XC7Z030-1SBG485C 1 GByte DDR3L commercial 1 - 2 weeks
TE0715-04-12S-1C XC7Z012S-1CLG485C 1 GByte DDR3L commercial 1 - 2 weeks

Pricing, Availability and Ordering

  • Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
  • Currently Available to US customers only.
  • Please email Ray at This email address is being protected from spambots. You need JavaScript enabled to view it. with questions / pricing / orders.

Technical Documentation from Trenz Electronic