TE0803 Zynq UltraScale+ Starter Kit
The Trenz Electronic Starter Kit consists of a TE0803-01-03EG-1EA MPSoC module with a mounted heatspreader on a TEBF0808-04 base board including a pre-assembled heatsink, in a black Core V1 Mini-ITX Enclosure. Supplied with a Be Quiet! 400W power supply for the enclosure, two mounted XMOD FTDI JTAG Adapter, an 8 GB micro SD card, an USB cable, screws and bolts.
TE0803-01-03EG-1EA MPSoC Module
The Trenz Electronic TE0803-01-03EG-1EA is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+. This module is equipped with 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's are provided via rugged high-speed stacking connections.
All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.
TE0803-01-03EG-1EA MPSoC Module Key Features
- Xilinx Zynq UltraScale+ XCZU3EG-1SFVC784E
- ZU3EG 784 Pin Packages
- Rugged for shock and high vibration resistance
- 2 GByte 64-Bit DDR4 SDRAM
- 128 MByte SPI Boot Flash dual parallel
- Plug-on module with 4 x 160 pin B2B connectors
- User I/O
- 65 x MIO, 156 I/O's x HP (3 banks)
- Serial transceiver: PS-GTR 4
- GT Reference clock input
- PLL for GT Clocks (optional external reference)
- Size: 52 x 76 mm
- 3 mm mounting holes for skyline heat spreader
- All power supplies on board
- Evenly spread supply pins for good signal integrity.
Other assembly options for cost or performance optimization plus high volume prices available on request.
TEBF0808-04 Base Board Key Features
- Mini-ITX form factor
- ATX Power supply connector (12V only PS Required)
- optional 12V Standard Power Plug
- USB3 with USB3 HUB
- Gigabit Ethernet RJ45
- MicroSD Card (bootable)
- eMMC (bootable)
- PCIe slot - PS GT Connected, one PCIe lane (16 Lane Connector)
- Displayport Single Lane PS GT Connected
- One SATA Connector
- FMC HPC Slot (1.8V max VCCIO)
- Dual SFP+
- One Samtec FireFly (4 GT lanes bidir)
- One Samtec FireFly connector for reverse loopback
- Fan connectors, PC Enclosure, FMC Fan
- Intel front panel connector (PWR/RST/LED)
- Intel HDA Audio connector
- CAN FD Transceiver (10 Pin IDC Connector)
- 20 Pin ARM JTAG Connector (PS JTAG0)
Core V1 Mini-ITX Enclosure Key Features
- Dimensions: 260 x 276 x 316 mm (B x H x T)
- Material: Steel
- Colour: Black
- Drive Slots: 2 x 3,5 Zoll (intern, 3,5 Zoll) and 2 x 2,5 Zoll (intern, 2,5 Zoll)
- Expansion slots: 2
- I/O-Panel: 2 x USB 3.0 and 1 x Audio In/Out each
- Maximum graphic card length: 255 mm (inner enclosure)
- Maximum graphic card length: 285 mm (outer enclosure)
- Maximum CPU cooler height: 140 mm
- Maximum length power supply: 200 mm
- 1 x Core V1 Mini-ITX Enclosure- black with viewing window and removable sled walls
- 1 x Power Supply Be quiet! BN142 System Power 7, 400 Watt, 12V, ATX 2.3 with fan
- 1 x TE0803-01-03EG-1EA with ZU3EG
- 1 x TEBF0808-04 base board
- 1 x mounted Heatspreader MaxiGriip 23 x 23 x 19.5 mm
- 1 x TE0790-02 XMOD FTDI JTAG Adapter (compatible with Xilinx-Tools)
- 1 x TE0790-02L XMOD FTDI JTAG Adapter (independent from Xilinx-Tools)
- 1 x 8 GB Class 4 microSDHC card
- 1 x USB cable, Typ A to Typ B Mini, 2 meter length
- 2 x Phillips screws, M3 x 6, pan head, zinc coated
- 2 x Spacer bolts, M3, 10 mm
Embedded Development Suite
A hardware development platform is available. Latest documentation, design support ﬁles, reference design source ﬁles and tools are available for download free of charge.
* Device supported by the free Xilinx Vivado WebPACK tool.
|TE0803-03-3EG-1EA-S||TE0803-01-03EG-1EA||XCZU3EG-1SFVC784E||TEBF0808-04||Core V1 Mini-ITX||inquire for latest|
Pricing, Availability and Ordering
- Concurrent EDA is the US Distributor for Trenz Electronic FPGA Micromodules.
- Currently Available to US customers only.