Zynq UltraScale+ RFSoC Modules

Zynq UltraScale+ RFSoC

The Industry’s Only
Single-Chip Adaptable Radio Platform

 

AMD Zynq RFSoC AMD Zynq RFSoC DFE
AMD Zynq RFSoC Block Diagram AMD Zynq RFSoC DFE Block Diagram

 

Integration of RF Analog

The monolithic integration of direct RF-sampling data converters onto an adaptive SoC eliminates the need for external data converters, enabling a flexible solution with up to 50% reduced power and footprint over a multi-component solution–including the elimination of the power-hungry FPGA-to-Analog interfaces like JESD204. This approach also enables a highly flexible solution, moving much of the RF signal processing into the digital domain.

SD-FEC

Zynq™ UltraScale+™ RFSoC integrates a soft-decision forward error-correction cores (SD-FEC) IP block with low-density parity checking (LDPC) and turbo codec support. The hardened cores delivers over 1Gb/s of performance at low latency, as well as lower power and smaller area than soft logic implementations.

Hardened Digital Front-End

Zynq RFSoC DFE is the latest adaptive RFSoC platform that integrates more hardened IP than soft logic for critical DFE processing. Enabling a flexible solution for 5G New Radio, Zynq RFSoC DFE operates up to 7.125GHz of input/output frequency with power-efficiency and cost-effectiveness.

       

Hardware Adaptability

The Zynq UltraScale+ RFSoC architecture integrates FPGA fabric for flexibility to meet a wide range of requirements with the same foundational hardware. The ability to leverage the same platform to address diverse requirements and emerging standards allows vendors to react quickly to new market opportunities.

Complete SoC for Single-Chip Radio

As a heterogeneous compute architecture that includes a full Arm processing subsystem, FPGA fabric, and complete analog/digital programmability across the RF signal chain, Zynq UltraScale+ RFSoCs provides a complete, single chip software-defined radio platform for diverse applications, and the ability to produce radio variants as market dynamics evolve.

       

 

Applications

5G and LTE Wireless

With Zynq™ RFSoC, wireless infrastructure manufacturers can achieve previously unattainable footprint and power reduction, critical to Massive MIMO deployment.
  • Up to 7.125GHz input/output frequency operation on a single device
  • Device variants with integrated LDPC SD-FEC cores and high DSP density for 5G baseband
  • Optimal millimeter wave IF implementations including fixed wireless access and mobile backhaul
  • Hardened radio digital front-end for up to 400MHz bandwidth (8T8R) for 5G New Radio (Zynq RFSoC DFE Only)

Remote-PHY for Cable Access DOCSIS 3.1

Zynq UltraScale+™ RFSoC enables cable access multi-service operators (MSOs) to move PHY layer processing closer to home with remote PHY nodes, increasing network capacity.
  • RF-Analog for stringent power & form factor constraints
  • LDPC to meet DOCSIS 3.1 requirements
  • Extended spectrum support for DOCSIS 4.0
  • FPGA logic for future-proofing and full duplex IP
 

Phased Array Radar/Digital Array RADAR

As a single-chip TRX solution for scalable, multi-function, phased array radar, the Zynq UltraScale+ RFSoC enables low latency transmit and receive for optimal response time in early warning scenarios.
  • Full L-Band Sampling
  • Partial S-Band Direct Sampling, full S-Band at 2nd Nyquist
  • Partial C-Band Direct Sampling
  • Software and hardware reconfigurable

Test & Measurement

Designers can build high-speed multi-function instruments for signal generation and signal analysis by using direct RF-sampling, highly flexible, reconfigurable logic, and software programmability in Zynq UltraScale+ RFSoC.
 

Satellite Communications

Designers can build high-speed multi-function instruments for signal generation and signal analysis by using direct RF-sampling, highly flexible, reconfigurable logic, and software programmability in Zynq UltraScale+ RFSoC.

Available Models

Model FPGA
Zynq MPSoC
RAM SPI
Flash
Form
factor
RFADC/RFDAC DSPs Temperature
Range
TE0835-03-MXE81-A ZU25DR -1 4 GB DDR4 2x 64 MB 6.5 x 9 cm 8 RFADCs with 4.096 GSPS
8 RFDACs with 6.554 GSPS
3145 extended
TE0835-03-TXE81-A ZU47DR -1 4 GB DDR4 2x 64 MB 6.5 x 9 cm 8 RFADCs with 5 GSPS
8 RFDACs with 9.85 GSPS
4272 extended
TE0835-03-TXE81-AK incl. heat spreader 4 GB DDR4 2x 64 MB 6.5 x 9 cm 8 RFADCs with 5 GSPS
8 RFDACs with 9.85 GSPS
4272 extended
TE0838-01-VXI81P-A * ZUxxDR -1 9 GB DDR4-2666 2x 64 MB 6.5 x 9 cm
TE0838-01-VXI91P-A * ZUxxDR -1 18 GB DDR4-3200 2x 64 MB 6.5 x 9 cm

* new product coming soon!

Pricing, Availability and Ordering

  • Concurrent EDA is the US Distributor for Trenz Electronic GmbH.
  • Currently available to North American customers only.
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Technical Documentation from Trenz Electronic

  • Available upon request.